ONSEMI REPLACES TINY WIRES INSIDE POWER CHIPS TO CUT ENERGY LOSSES

Summary from the TLDR Hardware newsletter

Onsemi's new Embedded Power Platform (EPP) builds power components directly into the silicon itself, wiring them together with precisely etched layers instead of the usual wire bonds, which cuts electrical losses and lets the parts switch faster. The idea is to design the electrical, thermal, and mechanical sides of a power system together from day one instead of separately, since treating them as separate problems has been forcing expensive redesigns late in development as devices demand more power in less space.