MICRON PLANS WAFER BONDING AT 1Ε AND HIGH-NA EUV LATER, PLUS DRAM STACKED ON TOP OF PROCESSORS

Summary from the TLDR Hardware newsletter

Micron's roadmap puts wafer bonding in its 1ε DRAM node, with High-NA EUV and new materials in later ζÅ and ηÅ nodes after 1δ ramps in the second half of 2027.