SAMSUNG ELECTRO-MECHANICS INVESTS 6.78 TRILLION WON IN AI CHIP PACKAGE SUBSTRATES

Summary from the TLDR Hardware newsletter

Samsung Electro-Mechanics is investing a combined 6.78 trillion won ($4.9 billion) to expand FC-BGA substrate production, 4.27 trillion won for a new plant at its Sejong site, and 2.51 trillion won for its Vietnam subsidiary, marking the company's largest-ever investment in a single product.