LUMENTUM, QUALCOMM, AND CORNING DEMO OPTICAL DIE-TO-DIE LINKS TO REPLACE COPPER IN AI RACKS

Summary from the TLDR Hardware newsletter

Lumentum, Qualcomm, and Corning are jointly demonstrating a board-level optical die-to-die interconnect at ECOC 2026, aimed at extending high-bandwidth, low-latency chip-to-chip connectivity well beyond what copper traces can support in AI systems.