OPENAI MAY DOUBLE-SOURCE NEXT-GEN AI CHIPS AT SAMSUNG, ALONGSIDE TSMC

Summary from the TLDR InfoSec newsletter

OpenAI Korea GM Harrison Kim revealed the company has made real progress with Samsung Electronics on joint production and research for its next-generation chips, expanding a relationship that so far has been mostly about memory supply and enterprise software. OpenAI's current inference ASIC, Jalapeño, was designed with Broadcom and built at TSMC in under 18 months and is already in mass production there, so any Samsung involvement more plausibly targets its successor, which is reportedly approaching tapeout.