CXMT REPORTEDLY BEGINS RISK PRODUCTION OF HBM3E, TARGETING MASS PRODUCTION IN 2027

Summary from the TLDR Hardware newsletter

CXMT has reportedly started risk production of HBM3E, a generation behind the HBM4 that Micron, Samsung, and SK hynix are already mass producing, but a meaningful jump for a company that only recently began mass-producing standard DRAM at competitive nodes. HBM is substantially harder to manufacture than ordinary DRAM, requiring high-yield die stacking, through-silicon vias, fine interconnects, thermal management, and packaging on top of competitive dies themselves, so reaching even a risk-production milestone signals China's memory ecosystem advancing past commodity DRAM.