TLDR AI · HEADLINES & LAUNCHES
BROADCOM, APPLE EXTEND TIE-UP TO 2031 WITH NEW CUSTOM CHIPS
Summary from the TLDR AI newsletter
Broadcom and Apple have expanded their partnership through to 2031. The companies are working together to develop application-specific integrated circuit (ASIC) silicon for multiple generations of Apple products. ASIC chips are increasingly vital to the development of components for processing artificial intelligence-related tasks. Apple plans to deploy its advanced AI servers as early as 2027.