TLDR AI · HEADLINES & LAUNCHES

BROADCOM, APPLE EXTEND TIE-UP TO 2031 WITH NEW CUSTOM CHIPS

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Summary from the TLDR AI newsletter

Broadcom and Apple have expanded their partnership through to 2031. The companies are working together to develop application-specific integrated circuit (ASIC) silicon for multiple generations of Apple products. ASIC chips are increasingly vital to the development of components for processing artificial intelligence-related tasks. Apple plans to deploy its advanced AI servers as early as 2027.