AI CHIPS ARE GETTING HOTTER. A MICROFLUIDICS BREAKTHROUGH GOES STRAIGHT TO THE SILICON TO COOL UP TO THREE TIMES BETTER

Summary from the TLDR newsletter

The chips used to run AI datacenters generate much more heat than previous generations of silicon. Current cooling technology will become a bottleneck to progress in just a few years. Microfluidics could boost efficiency and improve sustainability for next-generation AI chips. Microsoft has successfully developed an in-chip microfluidic cooling system that can effectively cool a server running core services for a simulated Teams meeting. The company's tests showed that microfluidics performed up to three times better than cold plates at removing heat. Advanced cooling technology would improve power usage effectiveness and reduce operational costs.