BEYOND 2NM: APPLE'S A20 CHIP TO INTRODUCE NEW PACKAGING BREAKTHROUGH

Summary from the TLDR newsletter

Apple's A20 chip, built on TSMC's second-gen 2nm process, will be used in the iPhone 18 Pro, 18 Pro Max, and iPhone 18 Fold. The processors use Wafer-Level Multi-Chip Module packaging, which allows different components to be integrated directly at the wafer level. The technique, which connects the dies without needing an interposer or substrate, brings both thermal and signal integrity benefits. This is a big leap in chip design and shows how technologies once reserved for data center GPUs and AI accelerators are making their way into smartphones.