M5 PRO CHIP COULD SEPARATE CPU AND GPU IN ‘SERVER GRADE' CHIPS

Summary from the TLDR newsletter

Apple's System-on-a-Chip (SoC) design tightly integrates all components, including both CPU and GPU, into a single package. TSMC's latest chip packaging process, known as SoIC-mH (System-on-Integrated-Chips-Molding-Horizontal), integrates different chips into a package in a way that improves thermal performance, allowing chips to run at full power for longer before they need to be throttled back to reduce heat. This approach may be used for the Pro, Max, and Ultra variants of the M5 chip. The M5 Pro chips will be used to power Apple Intelligence servers.