INTEL LOOKS BEYOND SILICON, OUTLINES BREAKTHROUGHS IN ATOMICALLY-THIN 2D TRANSISTORS, CHIP PACKAGING, AND INTERCONNECTS AT IEDM 2024

Summary from the TLDR newsletter

Intel's Foundry Technology Research team has announced technology breakthroughs in 2D transistor technology. It plans to unveil its research at the IEEE International Electron Devices Meeting 2024 conference. The research includes enhancements in gate-all-around transistor scaling and performance both with silicon and with atomically-thin 2D transistors that use beyond-silicon materials. It also outlines Intel's subtractive Ruthenium technology, which improves interconnect performance and scalability, ultimately enabling smaller wires between transistors, and a chip packaging breakthrough that improves chip-to-chip assembly throughput by 100x.