INTEL VS. SAMSUNG VS. TSMC

Summary from the TLDR Web Dev newsletter

Leading foundries Intel, Samsung, and TSMC are differentiating themselves with unique approaches to 3D chip design and packaging. Intel focuses on developing "sockets" for chiplets, Samsung is creating mini-consortia of chiplet providers, and TSMC offers a variety of packaging options and a new design language called 3Dblox. These foundries are also working on new technologies like custom HBM, backside power delivery, and glass substrates to address challenges in performance, power delivery, and signal integrity.